With CAD capabilities becoming more and more sophisticated, Quick Circuits has identified that conventional tooling and manufacturing methods cannot always be relied upon to provide the accuracy required.
Continuous investment in front-end technology has meant that Quick Circuits can take electronic data from its customers in a wide range of formats, process the data and network it direct to the manufacturing plant including automatic optical inspection. As a result of this investment, accuracy direct from CAD data can be achieved for complete manufacturing together with associated benefits such as faster turnaround times and cost savings.
Manufacturing Capability
| A.O.I | Electronic Data Processing | |
| Full Automatic Optical | Graphicode GC-CAM front end software (4 stations) | |
| Inspection to Gerber Data | Direct data transfer active 24 hours a day | |
| Formats accepted: | Drilling Formats | |
| All Gerber formats | Any ASCII format | |
| HPGL | ||
| DXF | ||
| DPF | ||
| Emma | ||
| EDIF 4.0.0 | ||
| Material Types FR4 G30 G2000 PTFE | High Specification | Standard Specification |
| Max. Circuit Size (Con.PTH) | 550x550 | 550x550 |
| Max. Circuit Size (M/L) | 550x550 | 457x355 |
| Max. Board Thickness | 4.0 | 4.0 |
| Min. Board Thickness (Conv.PTH) | 0.2 | 0.5 |
| Max. Layer Count | 36 | 14 |
| Min. Board Thickness (M/L) | 4L 0.3 | 0.6 |
| (Min. Multilayer. thickness on request) | ||
| Min. Track Width | 0.1 | 0.15 |
| Min. Gap Width | 0.15 | 0.15 |
| Impedence Control | +8% | +10% |
| Drilling | High Specification | Standard Specification |
| Min. Finished Hole Size | 0.2 | 0.3 |
| Max. Aspect Ratio | 10.0:1 | 8.0:1 |
| Min. Annular Ring | 0.127 | 0.127 |
| Resist Mask | High Specification | Standard Specification |
| Liquid Photoimageable | ||
| Min. solder dam | 0.127 | 0.127 |
| Notation | High Specification | Standard Specification |
| Standard White/Yellow (Min. line width) | 0.127 | 0.127 |
| Other colours on request | ||
| Photoimageable available | ||
| Surface | High Specification | Standard Specification |
| H.A.S.L. | ||
| Electroless Nickel Immersion Gold | 0.030 - 0.100 µm Gold | Over 3 - 6 µm Nickel |
| Silver | ||
| Immersion Tin | ||
| Electrolytic Hard Gold over Nickel | 1 -5 µm Gold | Over 3 - 5 µm Nickel |
| Pure Gold (Wirebonding) | ||
| Carbon Ink | ||
| Peelable Solder Resist | ||
| Bare Board Testing | High Specification | Standard Specification |
| Mania Cube | ||
| Programmable test voltage 10 - 40v | ||
| Flying Probe Testing | ||
| Min. pad size | 0.05 | 0.1 |
| Min. pitch | 0.1 | 0.2 |
| Testing to Gerber data | ||
| Single Board Testing | ||
| Impedence Testing | ||
| Using Time Domain Reflectrometry | ||
| Technologies | ||
| Impedance Control | ||
| Blind/Buried Vias | ||
| Hole Plugging | ||
| High Aspect Ratio Plating | ||
| HDI | ||
| Sequential Build up Technology | ||